HX Excellence provides a variety of testing solutions to ensure customers receive fully functional products with maximum reliability over time.
We utilize the latest machines for In-Circuit Tests (ICT) employing "Bed of Nails" and Flying Probe technology. The HX Excellence Test Engineering Team possesses extensive expertise in crafting solutions for ICT testing on bed of nails platforms, including:
- Keysight (Agilent)
- Teradyne
- GenRad
- SPEA
and on Flying Probe platforms:
- Spea 4040
- Spea 4050
- Spea 4060
The process is integrated with On-Board and Boundary Scan programming steps to ensure the highest quality of the production output.
The Boundary Scan test can be performed using different approaches:
- Embedded in the circuit test sequence
- Standalone via XJTAG platform
- Embedded in the functional test sequence
OUR SERVICES
Testing solutions provided by HX Excellence are resumed in the table below:
| APPLICATION | MACHINES AVAILABLE | |
| Parametric Testing (ICT) with flying probe | Low cost approach for low/mid volumes products manufacturing – electrical defects identification | 4/6 probes flying probe testers from Spea (4040/4060) |
| Parametric Testing (ICT) with bed of nails | Medium to High volume complex products manufacturing – electrical/functional defects identification | Spea (Unitest/Easytest/3030)
Agilent 3070 Teradyne Spectrum/1240 Genrad 22xx |
| High Voltage testing (Safety) | Regulatory validation (e.g. CE, UL, CSA requirements) | Custom test benches with ABAG instrumentations |
| Cable-scan testing | Complex racks and backplanes testing | Different solution from WEEE for low /high voltage testing |
| Run In / Burn in testing | Design validation and reliability testing | High transient chambers (+/- 20 °C/min) from -40 to +90 °C and walk in chambers |