The SMT production lines are a strategic asset for HX Excellence, which invests annually in machinery selected from the most modern and sophisticated options available in the market. This commitment extends to both organizational structure and technical know-how, leveraging personnel with extensive experience in production processes.
The assembly lines are equipped to handle BGA, ultra-fine pitch, LGA, and QFN components, and are versatile enough to mount on various substrate types, including FR4, Rogers, metal core aluminum, copper, duroyd, ceramic, CEM 1, and CEM 3.
Every phase of the SMT soldering process is monitored and validated using control instruments, including 3D Solder Paste Inspections that verify the accurate deposition of solder paste to 3D Automatic Optical Inspection, ensuring the quality of solder joints and the precise positioning of components.
HX Excellence also utilizes 3D X-RAY inspection machines to conduct checks on samples or the entire production run, providing cross-sectional images of solder balls.
Rework for BGA and microBGA can be executed using ERSA rework stations situated at the end of the SMT process. To streamline technological transfer processes, HX Excellence has standardized the configuration of SMT lines and the brands of machinery used across all production facilities.
EACH LINE IS CONFIGURED AS FOLLOWS:
- Loader
- Screen Print
- 3D SPI
- Pick and place
- Convection oven: 10 top/10 bottom zones
- 3D AOI
STAND-ALONE CONTROLS:
- 3D X-RAY Machine
- Automatic 3D X-RAY Machine
- BGA Rework Station
Assembly of:
- Chips till 01005
- Melf
- SMA SMB SMC SOT DPACK D2PAK
- Tantale Case A B C D E P
- Alu Cap < 10mm
- All inductors
- Mounting of BGA from 20 to 50 mm
- Fine pitch 0,4 mm
- POP: Package on Package
Process Controls:
- 3D SPI
- 3D AOI
- 3D X-RAY